Control the warpage in advanced packaging
Mechanical stress increases with size enlargement and material heterogeneity.Warpage has become an increasingly serious concern in advanced packaging, where the heterogeneous mixture of materials may ...
Mechanical stress increases with size enlargement and material heterogeneity.Warpage has become an increasingly serious concern in advanced packaging, where the heterogeneous mixture of materials may ...
Jean-Didier Allegrucci Joins Rain AI for Hardware Development Work.AI hardware processor developer Rain AI, backed by OpenAI's Sam Altman and investment banks, has hired former Apple chip executive Je...
At the opening ceremony of the 2024 Lujiazui Forum, the chairman of the China Securities Regulatory Commission (CSRC), Wu Qing, announced in advance that eight measures to deepen the reform of the Sci...
Automotive manufacturers (OEMs) must shift their mindset and be willing to embrace open standards in order to make the software-defined vehicle a reality.Guests:Suraj Gajendra, Vice President of Produ...
In recent years, there has been a global shortage of semiconductor talent in many developed industrial regions. Relatively speaking, the situation is most urgent in the United States, China, and South...
From January to May 2024, the domestic market shipped 122 million mobile phones, a year-on-year increase of 13.3%.Recently, data released by the China Academy of Information and Communications Technol...