The MDI (Multi-Chip Integration) alliance initiated by Samsung Electronics in June last year is now attracting more collaborators. Currently, the number of partners in the alliance, including several ...
TSMC remains the largest buyer of EUV equipment.TSMC's 2nm advanced process capacity is expected to be mass-produced in 2025, with equipment manufacturers actively delivering machines, especially the ...
In 2024, there was an increase of 5%, and in 2025, an increase of 8%.Last year was a terrible year for PC shipmentsâaccording to Gartner, it was the worst year in the industry's historyâdue to eco...
In high-performance computing systems, particularly AI servers, the capacity and bandwidth of memory (DRAM) are becoming increasingly important as processors need to handle massive amounts of data, an...
Mechanical stress increases with size enlargement and material heterogeneity.Warpage has become an increasingly serious concern in advanced packaging, where the heterogeneous mixture of materials may ...
Jean-Didier Allegrucci Joins Rain AI for Hardware Development Work.AI hardware processor developer Rain AI, backed by OpenAI's Sam Altman and investment banks, has hired former Apple chip executive Je...