The alliance expands, and the foundry giants "fight" for advanced packaging
The MDI (Multi-Chip Integration) alliance initiated by Samsung Electronics in June last year is now attracting more collaborators. Currently, the numb
The MDI (Multi-Chip Integration) alliance initiated by Samsung Electronics in June last year is now attracting more collaborators. Currently, the numb
TSMC remains the largest buyer of EUV equipment.TSMC's 2nm advanced process capacity is expected to be mass-produced in 2025, with equipment manufactu
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In 2024, there was an increase of 5%, and in 2025, an increase of 8%.Last year was a terrible year for PC shipments—according to Gartner, it was the w
In high-performance computing systems, particularly AI servers, the capacity and bandwidth of memory (DRAM) are becoming increasingly important as pro
Mechanical stress increases with size enlargement and material heterogeneity.Warpage has become an increasingly serious concern in advanced packaging,
Jean-Didier Allegrucci Joins Rain AI for Hardware Development Work.AI hardware processor developer Rain AI, backed by OpenAI's Sam Altman and investme
At the opening ceremony of the 2024 Lujiazui Forum, the chairman of the China Securities Regulatory Commission (CSRC), Wu Qing, announced in advance t
Automotive manufacturers (OEMs) must shift their mindset and be willing to embrace open standards in order to make the software-defined vehicle a real
In recent years, there has been a global shortage of semiconductor talent in many developed industrial regions. Relatively speaking, the situation is
From January to May 2024, the domestic market shipped 122 million mobile phones, a year-on-year increase of 13.3%.Recently, data released by the China