The most advanced manufacturing processes require various technical supports, and wiring is a crucial part.Applied Materials announced the launch of innovative material engineering technology, which i...
The U.S. government is launching a $1.6 billion funding competition for chip packaging R&D projects.The Biden administration announced on Tuesday that it will allocate up to $1.6 billion for advanced ...
Amazon Increases Cloud Service Prices.For decades, Moore's Law improvements in server CPU performance and cost-effectiveness have led us all to assume that, one way or another, we would always see a r...
On NVIDIA's journey to firmly establish its trillion-dollar market value, two key technical supports are indispensable. One of them is the CoWoS advanced packaging led by TSMC, and the other is the HB...
As a typical representative of the third-generation semiconductor materials, silicon carbide (SiC) has superior physical and chemical properties compared to silicon (Si), which enables SiC devices to ...
Ninety-one startups have raised $2.6 billion in funding.Artificial intelligence attracted more investors into the chip industry in the second quarter. Four AI-focused chip startups received over $100 ...