The alliance expands, and the foundry giants "fight" for advanced packaging
The MDI (Multi-Chip Integration) alliance initiated by Samsung Electronics in June last ye
The MDI (Multi-Chip Integration) alliance initiated by Samsung Electronics in June last ye
TSMC remains the largest buyer of EUV equipment.TSMC's 2nm advanced process capacity is ex
Advertisement
In 2024, there was an increase of 5%, and in 2025, an increase of 8%.Last year was a terri
In high-performance computing systems, particularly AI servers, the capacity and bandwidth
Mechanical stress increases with size enlargement and material heterogeneity.Warpage has b
Jean-Didier Allegrucci Joins Rain AI for Hardware Development Work.AI hardware processor d
At the opening ceremony of the 2024 Lujiazui Forum, the chairman of the China Securities R
Automotive manufacturers (OEMs) must shift their mindset and be willing to embrace open st
In recent years, there has been a global shortage of semiconductor talent in many develope
From January to May 2024, the domestic market shipped 122 million mobile phones, a year-on