Tech

Tech

The United States announces a grant of 1.6 billion U.S. dollars for advanced pac

The U.S. government is launching a $1.6 billion funding competition for chip packaging R&D projects.The Biden administration announced on Tuesday that it will allocate up to $1.6 billion for advanced ......

Apr 29, 2024

Tech

AWS charges a high fee for its own Arm chips

Amazon Increases Cloud Service Prices.For decades, Moore's Law improvements in server CPU performance and cost-effectiveness have led us all to assume that, one way or another, we would always see a r......

Apr 22, 2024

Tech

The battle for the giants, HBM is completely ignited

On NVIDIA's journey to firmly establish its trillion-dollar market value, two key technical supports are indispensable. One of them is the CoWoS advanced packaging led by TSMC, and the other is the HB......

Apr 21, 2024

Tech

The competition for silicon carbide is escalating, and Chinese companies are put

As a typical representative of the third-generation semiconductor materials, silicon carbide (SiC) has superior physical and chemical properties compared to silicon (Si), which enables SiC devices to ......

Apr 18, 2024

Tech

The financing situation of start-ups in the second quarter of 2024

Ninety-one startups have raised $2.6 billion in funding.Artificial intelligence attracted more investors into the chip industry in the second quarter. Four AI-focused chip startups received over $100 ......

Apr 16, 2024

Tech

The middle of the year has passed, how is the storage chip Q3 trend?

Over the past six months, the memory chip market has experienced several price fluctuations. From a stable start at the beginning of the year, to a rapid increase, and then to recent adjustments, each......

Apr 10, 2024